An integrated micro cooling system for electronic circuits

IEEE Transactions on Industrial Electronics

Volumn 48, Issue 2, 2001, Pages 281-285

  Schütze, Jörg ^b   Ilgen, Herman ^b   Fahrner, Wolfgang R ^a,c  

^a IEEE

^b ILFA GmbH   (Germany)

^c UNIVERSITY OF HAGEN   (Germany)

Author keywords

FR4 epoxy; Microchannel; Printed circuit board; Water cooling

Indexed keywords

COOLING WATER; COPPER; HEAT LOSSES; SEMICONDUCTOR DEVICE MANUFACTURE; TEMPERATURE; WATER COOLING SYSTEMS;

METHOXYNONAFLUOROBUTANE; MICROCHANNELS; POWER DISSIPATION; PRESSURE LOSSES;

PRINTED CIRCUIT BOARDS;

EID: 0035305074     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/41.915406     Document Type: Article

References (6)

1. Thermal conduction module: A high-performance multilayer ceramic package
2. Optimized cooling systems for semiconductor devices
3. Diode laser bar mounting on dielectric heat spreaders
4. Heat transfer in forced convection through fins
5. Monolithic and hybrid integration: Competition or complementary