Development of chemical-mechanical polished high-resolution zone plates

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 1789-1793

  Rehbein, Stefan ^a   Guttmann, Peter ^a   Werner, Stephan ^a   Schneider, Gerd ^a  

^a HAHN MEITNER INSTITUT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTIVE OPTICS; ELECTROPLATING; FILLING; GOLD; PROBLEM SOLVING;

CHEMICAL-MECHANICAL POLISHING (CMP) PROCESS; PLATING MOLDS; ZONE HEIGHT;

NICKEL;

EID: 37149003340     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2790917     Document Type: Article

References (21)

1. G. Schmahl, D. Rudolph, B. Niemann, P. Guttman, J. Thieme, G. Schneider, M. Diehl, and T. Wilhein, Optik (Stuttgart) 93, 66 (1993).
2. J. Kirz, C. Jacobsen, and M. Howells, Q. Rev. Biophys. 28, 33 (1995).
3. W. Chao, B. D. Harteneck, J. A. Liddle, E. H. Andersson, and D. T. Attwood, Nature (London) 0028-0836 10.1038/nature03719 435, 1210 (2005).
4. J. Kirz, J. Opt. Soc. Am. 64, 301 (1974).
5. S. Rehbein and G. Schneider, in Proc. of the 8th International Conf. on X-Ray Microscopy, Inst. Pure Appl. Phys. (Japan) Conf. Series 7, p. 103 (2006).
6. G. Schneider, Appl. Phys. Lett. 0003-6951 10.1063/1.120069 71, 2242 (1997).
7. M. Peuker, Appl. Phys. Lett. 0003-6951 10.1063/1.1361285 78, 2208 (2001).
8. J. Maser, X-Ray Microscopy IV (Bogorodskii Pechatnik, Chernogolovka, 1994), p. 523.
9. N. -H. Kim, G. -W. Choi, Y. -J. Seo, and W. -S. Lee, J. Vac. Sci. Technol. A 0734-2101 10.1116/1.2194926 24, 1297 (2006).
10. T. Du, A. Vijayakumar, K. B. Sundaram, and V. Desai, Microelectron. Eng. 0167-9317 10.1016/j.mee.2004.05.007 75, 234 (2004).
11. C. Kourouklis, T. Kohlmeier, H. H. Gatzen, Sens. Actuators, A 106, 263 (2003).
12. B. Cui, W. Wu, L. Kong, X. Sun, and S. Y. Chou, J. Appl. Phys. 0021-8979 10.1063/1.369885 85, 5534 (1999).
13. P. R. Krauss and S. Y. Chou, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.588303 13, 2850 (1995).
14. G. Schneider, T. Schliebe, and H. Aschoff, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.588271 13, 2809 (1995).
15. A. Holmberg, S. Rehbein, and H. M. Hertz, Microelectron. Eng. 73-74, 639 (2004).
16. A. Holmberg, M. Lindblom, and H. M. Hertz, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.2362761 24, 2592 (2006).
17. G. Schneider, Appl. Phys. Lett. 0003-6951 10.1063/1.121868 73, 599 (1998).
18. J. M. Steigerwald, S. P. Murarka, and R. J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials (Wiley, New York, 1997).
19. J. H. Smith, Proc. SPIE 0277-786X 10.1117/12.305615 3321, 798 (1998).
20. D. Weiss, M. Peuker, and G. Schneider, Appl. Phys. Lett. 0003-6951 10.1063/1.121190 72, 1805 (1998).
21. M. Lindblom, H. M. Hertz, and A. Holmberg, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.2395953 24, 2848 (2006).