The application of chemical-mechanical polishing for planarizing a SU-8/permalloy combination used in MEMS devices

Sensors and Actuators, A: Physical

Volumn 106, Issue 1-3, 2003, Pages 263-266

  Kourouklis, C ^a   Kohlmeier, T ^a   Gatzen, H H ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

Chemical mechanical polishing (CMP); MEMS; Permalloy; SU 8

Indexed keywords

ELECTROPLATING; HEAT TREATMENT; MICROELECTROMECHANICAL DEVICES; NICKEL ALLOYS; PHOTOSENSITIVITY; WEAR RESISTANCE;

MICROMOLDS;

CHEMICAL MECHANICAL POLISHING;

EID: 0041377032     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00180-8     Document Type: Conference Paper

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