The thermal design of a next generation data center: A conceptual exposition

1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1

Volumn , Issue , 2007, Pages 93-102

  Samadiani, Emad ^a   Joshi, Yogendra ^a   Mistree, Farrokh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA CENTERS; ELECTRONIC CABINETS; THERMAL DESIGN;

COOLING SYSTEMS; ELECTRONIC EQUIPMENT; HEAT FLUX; MICROPROCESSOR CHIPS; PROBLEM SOLVING;

DATA WAREHOUSES;

EID: 36949006482     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THETA.2007.363416     Document Type: Conference Paper

References (38)

1. APC (American Power Conversion) Corporation, http://www.ape.com.
2. Thermacore International, Inc., http://www.thermacore.com/default.asp.
3. IBM, http://ibm.com/eserver/xseries/storage/rack.html.
4. Liebert Corporation, hltp://www.liebert.com/dynamic/displayproduct.asp? id=1077&cycles=60hz.
5. Workshop Report, Simulation Based Engineering Science. 2004: National Science Foundation: Arlington, VA. p. 1-18.
6. Amon, C.H., S.-C. Yao, C.-F. Wu, and C.-C. Hsieh, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics. Journal of Heat Transfer, January 2005. 127: p. 66-75.
7. ASHRAE, Datacom Equipment Power Trends and Cooling Applications. 2005, Atlanta: American Society of Heating, Refrigeration and Air-Conditioning Engineers Atlanta.
8. Beaty, D. and R.R. Schmidt, Back to the Future: Liquid Cooling Data Center Consideration. ASHRAE Journal, December 2004: p. 42-47.
9. Bhopte, S., D. Agonafer, R. Schmidt, and B. Sammakia. Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature, in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73027.
10. Boucher, T.D., D.M. Auslander, C.E. Bash, C.C. Federspiel, and C.D. Patel. Viability of Dynamic Cooling Control in a Data Center Environment, in Inter Society Conference on Thermal Phenomena. 2004: IEEE.
11. Coggins, C., D. Gerlach, Y. Joshi, and A. Federov. Compact Low Temperature Refrigeration of Microprocessors. in Proceedings of the International Refrigeration and Air Conditioning Conference at Purdue University. 2006. Purdue.
12. Crippen, M.J., R.K. Alo, D. Champion, R.M. Clemo, C.M. Grosser, N.J. Gruendler, M.S. Mansuria, J.A. Matteson, M.S. Miller, and B.A. Trumbo, BladeCenter Packaging, Power, and Cooling. IBM J. Res. & Dev., 2005. 49(6): p. 887-904.
13. Fried, E. and I.E. Idelchik, Flow Resistance: A Design Guide for Engineers. 1989, New York: Hemisphere Publishing.
14. Gurram, S., S. Suman, Y. Joshi, and A. Fedorov. Thermal Issues in Next Generation Integrated Circuits, in IPACK 03 - International Electronic Packaging Technical Conference and Exhibition. 2003. Maui, Hawaii, USA: ASME.
15. Heydari, A. and P. Sabounchi. Refrigeration Assisted Spot Cooling of a High Heat Density Data Center. in Inter Society Conference of Thermal Phenomena. 2004: IEEE.
16. Incorporated, F., FLUENT v. 6.1 Users Manual. 2001: Lebanon, New Hampshir: Fluent Incorporated
17. Iyengar, M., R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. Sri-Jayantha, Y. Amemiya, H. Dang, T. Chainer, and B. Sammakia. Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling. in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73387.
18. Joshi, Y. and X. Wei. Micro and Meso Scale Compact Heat Exchangers in Electronics Thermal Management-A Review, in Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology. September 2005. NJ, USA.
19. Kang, S., R. Schmidt, K.M. Kelkar, A. Radmehr, and S.V. Patankar. A Methodology for the Design of Perforated Tiles in a Raised Floor Data Center Using Computational Flow Analysis, in ITHERM 2000 - Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2000. Las Vegas, Nevada.
20. Karki, K.C., S.V. Patankar, and A. Radmehr. Techniques for controlling airflow distribution in raised-floor data centers. 2003. Maui, HI, United States: American Society of Mechanical Engineers, New York, NY 10016-5990, United States.
21. Panchal, J.H., A framework for simulation-based integrated design of multiscale products and design processes PhD, G.W. Woodruff School of Mechanical Engineering. 2005, Georgia Institute of Technology: Atlanta, GA.
22. Patel, C.D., R. Sharma, C. Bash, and M. Beitelmal. Thermal Considerations in Cooling of Large Scale High Compute Density Data Centers. in ITHERM 2002 - Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2002. San Diego, California.
23. Rambo, J. and Y. Joshi. Physical Models in Data Center Airflow Simulations, in IMECE-03 - ASME International Mechanical Engineering Congress and R&D Exposition. 2003. Washington D.C.: IMECE03-41381.
24. Rambo, J. and Y. Joshi. Multi-Scale Modeling of High Power Density Data Centers, in InterPACK03 - The Pacific Rim / ASME International Electronics Packaging Technical Conference and Exhibition. 2003. Kauai, Hawaii: InterPack2003-35297.
25. Rambo, J. and Y. Joshi, Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers, in The Handbook of Numerical Heat Transfer, W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy, Editors. 2006, Taylor and Francis, New York, pp.
26. Rolander, N., An approach for the robust design of air cooled data center server cabinets,Master of Science, G. W. School of Mechanical Engineering. 2005, Georgia Institute of Technology: Atlanta.
27. Schmidt, R., K.C. Karki, and S.V. Patankar. Raised-Floor Data Center: Perforated Tile Flow Rates for Various Tile Layouts. in ITHERM 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. 2004. Las Vegas, NV.
28. Schmidt, R., R. Chu, M. Ellsworth, M. Iyengar, D. Porter, V. Kamath, and B. Lehman. Maintaining Datacom Rack Inlet Temperatures with Water Cooled Heat Exchanger. in ASME InterPACK. 2005. San Fransisco, California, USA: ASME, IPACK2005-73468.
29. Schmit, R. and M. Iyengar. Effect of Data Center Layout on Rack Inlet Air Temperatures, in ASME, IPACK2005-7338S. 2005. San Francisco, California, USA: ASME InterPACK.
30. Shah, A., V. Carey, C. Bash, and C. Patel. Exergy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part II, Application and Validation, in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73138.
31. Shah, A., V. Carey, C. Bash, and C. Patel. Exergy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part I, Analysis. in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73137.
32. Sharma, R.K., C.E. Bash, and C.D. Patel. Dimensionless Parameters for the Evaluation of Thermal Design and Performance of Large-Scale Data Centers, in AIAA-2002-3091. 2002.
33. Shrivastava, S., B. Sammakia, R. Schmidt, and M. Iyengar. Comparative Analysis of Different Data Center Airflow Management Configurations, in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73234.
34. Simpson, T.W., U. Lautenschlager, and F. Mistree, Towards Mass Customization in the Age of Information: The Case for Open Engineering Systems. The Information Revolution: Present and Future, ed. W. Read and A. Porter. 1998, CT: Ablex Publications.
35. VanGilder, L.W. and R. Schmidt. Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center. in ASME InterPACK. 2005. San Francisco, California, USA: ASME, IPACK2005-73375.
36. Wang, D. A Passive Solution to a Difficult Data Center Environmental Problem, in Inter Society Conference on Thermal Phenomena. 2004: IEEE.
37. Williams, Z.A. and J.A. Roux. Graphite foam thermal management of a high packing density array of power amplifiers, in AIAA 2006-3609, 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference. 5-8 June 2006. San francisco, California.
38. Zuo, Z.J., L.R. Hoover, and A.L. Phillips, "An integrated thermal architecture for thermal management of high power electronics "in Thermal Challenges in Next Generation Electronic Systems. Joshi & Garimella ed. 2002, Rotterdam: Millpress.