Dimensionless parameters for evaluation of thermal design and performance of large-scale data centers

8th AIAA/ASME Joint Thermophysics and Heat Transfer Conference

Volumn , Issue , 2002, Pages

  Sharma, Ratnesh K ^a   Bash, Cullen E ^a   Patel, Chandrakant D ^a  

^a HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR HANDLING SYSTEMS; CONVECTIVE HEAT TRANSFER; DIMENSIONLESS PARAMETERS; HIGH POWER DENSITY; LARGE-SCALE DATUM; NON-DIMENSIONAL PARAMETERS; PROOF OF CONCEPT; THERMAL DESIGNS;

COMPUTATIONAL FLUID DYNAMICS; ENERGY EFFICIENCY; ENERGY UTILIZATION; HEAT CONVECTION;

DESIGN;

EID: 84897584609     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Patel, C.D., Apr 2000, "Enabling pumped liquid loop cooling: Justification and the Key Technology and Cost Barriers", HDI Conf., Denver
2. Patel, C.D., Bash, C.E., Belady, C., Stahl, L., Sullivan, D., July 2001, "Computational fluid dynamics modeling of high compute density data centers to assure system inlet air specifications", Proceedings of IPACK'01-The PacificRim/ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, Hawaii.
3. The Uptime Institute, 2000, "Heat density trends in Data Processing, Computer systems and Telecommunications Equipment", White Paper issued by The Uptime Institute.
4. Friedrich, R., Patel, C.D., Jan 2002, "Towards planetary scale computing-technical challenges for next generation Internet computing", THERMES 2002, Santa Fe, New Mexico
5. Patel, C.D., Sharma, R.K, Bash, C.E., Beitelmal, A, May 2002, "Thermal Considerations in Cooling Large Scale High Compute Density Data Centers", ITherm 2002-Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, California
6. Stahl, L., Belady, C. L., Oct 2001, "Designing an Alternative to Conventional Room Cooling", Proceedings of the INTELEC'01 International Telecommunications Energy Conference, Edinburgh, Scotland
7. Schmidt, R, July 2001, "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures", Proceedings of IPACK'01-The PacificRim/ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, Hawaii
8. HP A-Class servers, http://www.hp.com/products1/ servers/rackoptimized/mpeix/aclass/ index.html, 2002
9. Flovent version 3.2, Flomerics Ltd., 81 Bridge Road, Hampton Court, Surrey, KT8 9HH, England