Thermal issues in next generation integrated circuits

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 659-664

  Gurrum, Siva ^a   Suman, Shivesh ^a   Joshi, Yogendra ^a   Fedorov, Andrei ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Chip centric cooling; Electronic cooling; ITRS roadmap

Indexed keywords

BOUNDARY CONDITIONS; COOLING; CORROSION; FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; MICROPROCESSOR CHIPS; THERMAL CONDUCTIVITY; THERMAL EFFECTS; TEMPERATURE CONTROL;

CHIP-CENTRIC COOLING; ELECTRONIC COOLING; ITRS ROADMAPS; COOLING OF ELECTRONICS; COOLING SOLUTIONS; CURRENT GENERATION; ELECTRONIC DEVICE; FUNDAMENTAL LIMITS; HEAT REMOVAL; HIGH-PERFORMANCE MICROPROCESSORS; INTERFACE THERMAL RESISTANCE; ITRS ROADMAP; OVERALL THERMAL RESISTANCE; POWER DISSIPATION; TEMPERATURE RISE; THERMAL MANAGEMENT; VARIOUS CONFIGURATION;

INTEGRATED CIRCUITS; CHIP SCALE PACKAGES;

EID: 1242331850     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35309     Document Type: Conference Paper

References (8)

1. R. Viswanath, V. Wakharkar, A. Watwe, and V Lebonheur, "Thermal Performance Challenges from Silicon to Systems," Intel Technology Journal, Q3, 2000.
2. ITRS 2001 ed., International Technology Roadmap for Semiconductors, 2001.
3. Y. L. Shen, "Analysis of Joule Heating in Multilevel Interconnects," Journal of Vacuum. Science and Technology B, vol. 17, pp. 2115-2121, 1999.
4. M. N. Ozisik, Heat Conduction, Wiley-Interscience Publication, New York, 1980.
5. M. M. Yovanovich, Y. S. Muzychka, and J. R. Culham, "Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels," AIAA Journal of Thermophysics and Heat Transfer, vol. 13, pp. 495-500, 1999.
6. Intel Pentium 4 processor in the 478-Pin Package Thermal Design Guidelines, May 2002.
7. J. P. Gwinn and R. L. Webb, "Performance and Testing of Thermal Interface Materials", Thermal Challenges in Next Generation Electronic Systems (Thermes 2002), pp. 201-210, 2002.
8. K. Azar and J. E. Graebner, "Experimental Determination of Thermal Conductivity of Printed Wiring Boards", Journal of Heat Transfer, vol. 119, pp. 401-405, August 1997.