Microelectromechanical system-based evaporative thermal management of high heat flux electronics

Journal of Heat Transfer

Volumn 127, Issue 1, 2005, Pages 66-75

  Amon, Cristina H ^a   Yao, S C ^a   Wu, C F ^a   Hsieh, C C ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ELECTRONIC EQUIPMENT; EVAPORATION; FLUID MECHANICS; MICROELECTROMECHANICAL DEVICES; NOZZLES; THERMOANALYSIS; VAPORIZATION;

DIELECTRIC COOLANTS; EMBEDDED DROPLET IMPINGEMENT; INTEGRATED COOLING OF ELECTRONICS; LATENT HEATS; SURFACE TEXTURING;

HEAT FLUX;

ELECTRONICS INDUSTRY; EVAPORATION; HEAT FLUX; HEAT TRANSFER;

EID: 15044364694     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1839586     Document Type: Article

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