Optimization of data center room layout to minimize rack inlet air temperature

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 33-42

  Bhopte, Siddharth ^a   Schmidt, Roger ^b   Agonafer, Dereje ^a   Sammakia, Bahgat ^c  

^a The University of Texas at Arlington   (United States)

^b IBM   (United States)

^c State University of New York at Binghamton   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA PROCESSING; MATHEMATICAL MODELS; OPTIMIZATION; THERMAL VARIABLES MEASUREMENT;

COMPLEX DECISIONS; OPTIMAL DATA CENTER PERFORMANCE;

THERMAL EFFECTS;

EID: 32844456619     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. The Uptime Insitute, from the whitepaper entitled "Heat Density Trends in Data Processing, Computer Systems and Telecommunication Equipment". www.uptimeinstitute.org
2. Schmidt R., Cruz E., "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting both the Hot and Cold Aisles", Itherm Conference, San Diego, California, June, 2002, pp. 580-594
3. Schmidt R., "Effect of Data Center Characteristics on Data Center Processing Equipment Inlet Temperatures", Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15870, Kauai, Hawaii, July 8-13, 2001, pp. 1097-1106
4. Patel C., Sharma. R., Bash, C., and Beitelmal, A., "Thermal Considerations in Cooling Large Scale Compute Density Data Centers", Itherm Conference, San Diego, California, June 2002, pp. 767-776
5. Guggari S., Agonafer D., Belady C., Stahl L., "A Hybrid Methodology for the Optimization of Data Center Room Layout", Paper No., IPACK2003-35273, Proceedings of IPACK'03, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
6. Karki K.C., Patankar S.V., Radmehr A., "Techniques for Controlling Airflow Distributions in Raised Floor Data Centers", Paper No., IPACK2003-35282, Proceedings of IPACK'03, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
7. Sharma R.K., Cullen B.E., Patel C.D., "Dimensionless Parameters For Evaluation of Thermal Design And Performance of Large Scale Data Centers", Paper No. AIAA2002-3091, American Institute of Aeronautics and Astronautics Conference, 2002.
8. Schmidt R., Cruz E., "Clusters of High Powered Racks Within a Raised Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures", ASME Journal of Electronic Packaging, December 2004, Vol. 126, pp. 510-518.
9. Wang D., "A Passive Solution to a Difficult Data Center Environment Problem", Paper No., IEEE 0-7803-8357, Inter Society Conference on Thermal Phenomena, 2004, pp. 586-592.
10. Auslander D., Boucher T., Chen K., Federspiel C., Carey V., Shah A., Bash C., Patel C., "Smart Cooling of Data Centers to Enable Energy Efficient Operation and Compaction", ppt., Center for Information Technology Research in the Interest of Society.
11. Flotherm version 4.2, Flomerics Ltd., U.K.
12. Flotherm User Manual, Flomerics Ltd., U.K.