Back to the future - Liquid cooling: Data center considerations

ASHRAE Journal

Volumn 46, Issue 12, 2004, Pages 42-48

  Beaty, Don ^a,b   Schmidt, Roger ^c  

^a DLB ASSOCIATES CONSULTING ENGINEERS   (United States)

^b Mission Critical Facilities   (United States)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DATA COMMUNICATION EQUIPMENT; DATA COMMUNICATION SYSTEMS; MICROPROCESSOR CHIPS; SERVERS;

DATACOM CENTERS; LIQUID COOLING; LIQUID-COOLED COMPUTERS;

COOLING SYSTEMS;

EID: 11344280684     PISSN: 00012491     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Delia, D., et al. 1992. "System cooling design for the water-cooled IBM Enterprise System/9000 processors." IBM Journal of Research and Development, 36(4):791-803.
2. Courtesy of Roger Schmidt, IBM Corp.
3. Schmidt, R. and B. Notohardjono. "High end server low temperature cooling." IBM Journal of Research and Development 46(6):739-751.
4. Pautsch, G. 2001. "An overview on the system packaging of the CRAY SV2 supercomputer." Proceedings of IPACK'01, The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition pp. 617-624.
5. Moore, G.E. 1965. "Cramming more components onto integrated circuits." Electron (38):114-117.
6. Taur, Y., and E.J. Novak. 1999. "CMOS devices below 0.1 um: how high will performance go?" International Symposium on VLSI Technology, Systems and Applications pp. 6-9.
7. Needham, W., C. Prunty, and E.H. Yeoh. 1998. "High volume microprocessor test escapes, an analysis of defects our tests are missing." International Test Conference.
8. Beaty, D. "Liquid cooling friend or foe." ASHRAE Winter Meeting 2003.