Maintaining datacom rack inlet air temperatures with water cooled heat exchanger

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 663-674

  Schmidt, Roger ^a   Chu, Richard C ^a   Ellsworth, Mike ^a   Iyengar, Madhu ^a   Porter, Don ^a   Kamath, Vinod ^a   Lehman, Bret ^a  

^a IBM   (United States)

Author keywords

Bladecenter; Data center; Heat exchanger; Rear door; Water cooled

Indexed keywords

COOLING; ELECTRONIC EQUIPMENT; HEAT EXCHANGERS; HEAT LOSSES;

BLADECENTER; DATA CENTER; REAR DOOR; WATER COOLED;

INTAKE SYSTEMS;

EID: 32844460865     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73468     Document Type: Conference Paper

References (5)

1. ASHRAE, "Thermal Guidelines for Data Processing Equipment", 2004, available from http://tc99.ashraecs.org/
2. Schmidt, R., "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures", Advances in Electronic Packaging 2001 (Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15870, Kauai, Hawaii, July 8-13, 2001, pp. 1097-1106.
3. Flotherm 4.2 reference manual, www.flotherm.com.
4. Turner, W. Pitt, "Industry Standard Tier Classifications Define Site Infrastructure Performance", http://www.upsite.com/csepages/papers/tiers. html.
5. Roger Schmidt survey of locations around U.S.