Multi-scale modeling of high power density data centers

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 521-527

  Rambo, Jeffrey D ^a   Joshi, Yogendra K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Data center; Multi scale; Thermal characterization

Indexed keywords

AIR CONDITIONING; ALGORITHMS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ENERGY DISSIPATION; MATHEMATICAL MODELS; NAVIER STOKES EQUATIONS; POROUS MATERIALS; SERVERS; DISTRICT HEATING; ELECTRONICS PACKAGING; FLOORS; THERMAL LOAD;

COMPUTER ROOM AIR CONDITIONING (CRAC) UNITS; HIGH POWER DENSITY; CFD MODELS; CHIP-LEVEL; COMPUTATIONAL FLUID DYNAMICS MODELING; COMPUTING HARDWARE; DATA CENTERS; DESIGN METHODOLOGY; END USERS; FLOOR COOLING; FLOOR SPACE; HEAT GENERATORS; HEAT LOADS; HOT SPOT; LENGTH SCALE; MAXIMUM TEMPERATURE; MODELING FRAMEWORKS; MULTI-SCALE MODELING; MULTISCALE MODELS; MULTISCALES; PARAMETRIC STUDY; POWER DENSITIES; RECIRCULATIONS; REYNOLDS-AVERAGED NAVIER-STOKES; STORAGE DEVICES; SUBMODELS; TEMPERATURE RISE; THERMAL CHARACTERIZATION; THERMAL RESPONSE;

ELECTRONICS PACKAGING; SATELLITE COMMUNICATION SYSTEMS;

EID: 1242309513     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35297     Document Type: Conference Paper

References (8)

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