An integrated experimental and computational system for the thermal characterization of complex three-dimensional submicron electronic devices

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 597-603

  Raad, Peter E ^a   Komarov, Pavel L ^a   Burzo, Mihai G ^a  

^a Southern Methodist University   (United States)

Author keywords

Computer software; Field effect transistors; Integrated circuit (IC) thermal factors; Integrated circuits; Laser measurements; Metal oxide semiconductor field effect transistor (MOSFET); MOSFET; Semiconductor defects; Semiconductor device measurements; Semiconductor devices; Simulation; Simulation software; Thermography; Thermoreflective thermography (TRTG); Time domain measurements; Transistors

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; CRYSTAL DEFECTS; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMODYNAMICS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); THIN FILMS; TIME DOMAIN ANALYSIS;

SIMULATION SOFTWARE; SUBMICRON ELECTRONIC DEVICES; THERMOREFLECTIVE THERMOGRAPHY;

MOSFET DEVICES;

EID: 36849088054     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.910043     Document Type: Conference Paper

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