Development of reliability verification system for robust package design

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Shin, Dongkil ^a   Baek, Hyunggil ^a   Oh, Joonyoung ^a   Kwak, Dongok ^a   Kim, Kuyoung ^a   Song, Younghee ^a   Kim, Jeongyeol ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DATABASE SYSTEMS; DESIGN FOR TESTABILITY; FINITE ELEMENT METHOD; RELIABILITY THEORY; STANDARDIZATION;

DESIGN FOR RELIABILITY; DESIGN FOR SIX SIGMA; PROCESS SERVERS;

ELECTRONICS PACKAGING;

EID: 36348983337     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360020     Document Type: Conference Paper

References (21)

1. Song, Y.H. and Lee, D.H., "Technical Challenges in Memory Packaging", SMTA Pan Pacific Microelectronics Sysposium, Hawaii, 2004
2. h Int. Conf on Microelectronics, NIS, Yugoslavia, 1997, pp. 25-30.
3. Zhang, G.Q. et al, "Virtual thermo-mechanical prototyping of electronic packaging challenges in material characterization and modeling," Proc Electronic Components and Technology Conference, 2001
4. th Asian Test Symposium (STC'03), 2003.
5. th Int Conf on EuroSimE, 2006.
6. Wu,J. et al, "Computer Aided Reliability Assessment," Proc ICEPT, 2003, pp. 36-39.
7. Snook,I. et al, "Physics of Failure As an Integrated Part of Design for Reliability," Proc Annual Reliabiliity and Maintainability Symposium, 2003, pp. 46-54.
8. Brue,G. and Launsby, R.G., Design for Six Sigma, McGraw-Hill (New York, 2003)
9. h Int. Conf. on EuroSimE, 2006
10. h Int. Conf on EuroSimE, 2006
11. JEP70-B, "Quality and Reliability Standards and Publications", JEDEC Solid State Technology Association, (1999)
12. JESD94, "Application Specific Qualification Using Knowledge Based Test Methodology", JEDEC Solid State Technology Association, (2004)
13. Wong, E. H. et al, "Advanced Moisture Diffusion Modeling and Characterisation for Electronic Packaging", ECTC, 2002, pp. 1297-1303
14. Syed, A., "Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints", ECTC, 2004.
15. Freund,L.B., Dynamic fracture mechanics. Cambridge University Press, (Cambridge, 1990)
16. Shin,D.K., and Lee,J.J., "Fracture parameters of interfacial crack of bimaterial under the impact loading," Int. J. of Solids and Structures, Vol. 38 (2001), pp. 5303-5322.
17. Shin, D.K. et al, "Development of multi stack package with high drop reliability by experimental and numerical methods," Proc 56th Electronic Components and Technology Conf 2006, pp. 377-382
18. JESD22B113, "Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products", JEDEC Solid State Technology Association (2006)
19. Lee,D.Y. et al, "Evaluation on Die Cracking due to Handling Damage in FBGA DDP for Memory Device using Handling Impact Test", IMAPS, 2004, Long Beach
20. Post, D., Han, B.T., and Ifju, P., High sensitivity Moire, Springer-Verlag, (New York, 1994)
21. Shin,D.K. et al, "Optimal Structural Design of Multi Chip Packageto Reduce the Failure in Substrate", Key Engineering Materials Vols. 297-300 (2005) pp. 912-917