IC reliability simulator ARET and its application in design-for-reliability

Proceedings of the Asian Test Symposium

Volumn 2003-January, Issue , 2003, Pages 18-21

  Xuan, Xiangdong ^a   Chatterjee, A ^a   Singh, A D ^b   Kim, N P ^c   Chisa, M T ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b AUBURN UNIVERSITY   (United States)

^c BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN; INTEGRATED CIRCUITS; RECONFIGURABLE HARDWARE; RELIABILITY; RELIABILITY ANALYSIS; SENSITIVITY ANALYSIS; VLSI CIRCUITS;

BOEING COMPANIES; DESIGN FOR RELIABILITY; FAILURE MECHANISM; FEATURE RELIABILITY; IC RELIABILITY; ITS APPLICATIONS; PHYSICAL DEFECTS; STATISTICAL APPROACH;

INTEGRATED CIRCUIT DESIGN;

EID: 77953091590     PISSN: 10817735     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ATS.2003.1250775     Document Type: Conference Paper

References (5)

1. C. Hu, "IC Reliability Simulation," IEEE Journal of Solid-State Circuits, Vol. 27, No. 3, pp. 241-246, March 1992.
2. X. Xuan, A. Chatterjee, and A. D. Singh, "ARET for System-Level IC Reliability Simulation," International Reliability Physics Symposium, Vol. 41, pp. 572-574, March 2003.
3. J. R. Lloyd, P. M. Smith, and G. S. Prokop, "The Role of Metal and Passivation Defects in Electromigration-Induced Damage in Thin Film Conductors," Thin Solid Films, pp. 385-395, 1982.
4. Y. Leblebici, S. M. Kang, C. T. Sah, and T. Nishida, "Modeling and Simulation of Hot Electron Effects for VLSI Reliability," International Test Conf., pp. 252-255, 1987.
5. X. Xuan, A. D. Singh, and A. Chatterjee, "Reliability Evaluation for Integrated Circuit with Defective Interconnect under Electromigration," International Symposium on Quality Electronic Design, pp. 29-34, San Jose, March 2003.