Computer aided reliability assessment

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 36-39

  Wu, Ji ^a   Pecht, M ^a   Wang, Jiaji ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b FUDAN UNIVERSITY   (China)

Author keywords

Circuits; Failure analysis; Geometry; Materials testing; Military standards; Packaging; Qualifications; Robustness; Software libraries; Stress

Indexed keywords

COMPUTER SOFTWARE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; GEOMETRY; MATERIALS TESTING; NETWORKS (CIRCUITS); PACKAGING; PACKAGING MATERIALS; PRODUCT DESIGN; ROBUSTNESS (CONTROL SYSTEMS); SOFTWARE TESTING; STANDARDS; STRESSES;

CIRCUIT CARD; COMPUTER AIDED RELIABILITIES; DESIGN FOR RELIABILITY; ELECTRONIC PRODUCT; ELECTRONIC SYSTEMS; INTEGRATED SOFTWARE; QUALIFICATIONS; SOFTWARE LIBRARIES;

SOFTWARE RELIABILITY;

EID: 36349007886     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298689     Document Type: Conference Paper

References (6)

1. P. McCluskey, M. Pecht and S. Azarm. "Reducing Time-to-Market Using Virtual Qualification," Proceedings, Institute of Environmental Sciences, pp. 148-152, 1997.
2. P. McCluskey, "Rapid Reliability Assessment of ULSI Electronics," Proceedings of the 18th International VLSI Multilevel Interconnection, held in Santa Clara, CA, November 28-29, 2001.
3. P. McCluskey, M. Pecht and M. Osterman, "Software for Reliability Assessment of Electronic Components, Circuit Cards and Equipment," Proceedings of the Second International Symposium on Electronic Packaging Technology, Shanghai, China, pp. 472-483, December 9-12, 1996.
4. P. Lall and M. Pecht, "Physics of Failure Based Computer Tools For Design of Microelectronic Packages," 3rd International Microelectronics and Systems 93' Conference, Kuala Lumpur, Malaysia, August 10-13, 1993.
5. G. Braunberg, J. Naft, M. Pecht, "Computer Aided Life Cycle Engineering," Proceedings of Annual Reliability and Maintainability Symposium, 1988, pp 26-31.
6. M. Osterman, D. Morton, P. Jackson, M. Rosman and D. Hoffman, "Software as a Method of Technology Transfer," Proceedings of the University Government Industry Microelectronics Symposium, Austin, TX, pp. 6-11, May 16-17, 1995.