Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent circuit formulation

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1889-1896

  Pinello, William ^a   Cangellaris, Andreas C ^a   Ruehli, Albert ^a  

^a University of Arizona   (United States)

Author keywords

Circuit modeling; Circuit transient analysis; Integrated circuit interconnections; Packaging; Simulation; Transient propagation

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC FIELDS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; SPURIOUS SIGNAL NOISE; TRANSIENTS;

INTERCONNECTIONS;

ELECTRONICS PACKAGING;

EID: 0031248523     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641787     Document Type: Article

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