Accurate power supply and ground plane pair models

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 259-266

  Wu Hungjen, Henry ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; TRANSMISSION ELECTRON MICROSCOPY;

COUPLED TRANSMISSION LINES (CTL);

ELECTRIC POWER SUPPLIES TO APPARATUS;

EID: 0033310487     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784473     Document Type: Article

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