Coax Via - A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1981-1985

  Pillai, Edward R ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRIC IMPEDANCE; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

COAX VIA;

ELECTRONICS PACKAGING;

EID: 0031251565     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641808     Document Type: Article

References (7)

1. E. Pillai and W. Wiesbeck, "Derivation of equivalent circuits for multilayer PCB discontinuities using full wave models," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1774-1783, Sept. 1994.
2. M. Kim, "Crosstalk control for microstrip circuits on PCB's at microwave frequencies," Tech. Rep. 0-7803-2573, AT&T Bell Laboratories-Eng. Res. Center, Princeton, NJ, July 1995.
3. A. Taflove, Computational Electrodynamics-The Finite Difference Time Domain Method. Norwood, MA: Artech House, 1995.
4. S. M. Rao, "Electromagnetic scattering and radiation of arbitrarilyshaped surfaces by triangular patch modeling," Ph.D. dissertation, Dept. Elect. Eng., Univ. Mississippi, University, MS, 1980.
5. T. Itoh, Numerical Techniques for Microwave and Millimeter-Wave Passive Structures. New York: Wiley, 1989.
6. D. M. Pozar, Microwave Engineering. Reading, MA: Addison-Wesley, 1990.
7. J.-P. Berenger, "A perfectly matched layer for the absorption of electromagnetic waves," J. Comput. Phys., vol. 114, pp. 185-200, Oct. 1994.