Tensile testing of MEMS materials-recent progress

Journal of Materials Science

Volumn 38, Issue 20, 2003, Pages 4075-4079

  Sharpe Jr , W N ^a   Bagdahn, J ^a   Jackson, K ^a   Coles, G ^a  

^a Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; POISSON RATIO; POLYSILICON; SILICON CARBIDE; STANDARDIZATION; STRAIN; THICK FILMS;

MEMBRANE TESTS; STRESS MEASUREMENT;

TENSILE TESTING;

EID: 0345015826     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026313102468     Document Type: Article

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