Design and performance of a 60-GHz multi-chip module receiver employing substrate integrated waveguides

IET Microwaves, Antennas and Propagation

Volumn 1, Issue 5, 2007, Pages 961-967

  Samanta, K K ^a   Stephens, D ^b   Robertson, I D ^a  

^a UNIVERSITY OF LEEDS   (United Kingdom)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

LOW NOISE AMPLIFIERS; MICROWAVE ANTENNAS; MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; THICK FILMS; WAVE FILTERS;

DOWNCONVERTER; INTEGRATED WAVEGUIDES; LUMPED ELEMENTS; SHORT BOND-WIRE LENGTHS;

WAVEGUIDES;

EID: 35348991191     PISSN: 17518725     EISSN: 17518733     Source Type: Journal    
DOI: 10.1049/iet-map:20060301     Document Type: Article

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