Liquid crystal polymer (LCP) for microwave/millimeter wave multilayer packaging

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2003, Pages 2273-2276

  Wei, Z ^a   Pham, A ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INSERTION LOSSES; MILLIMETER WAVES; OPTICAL INTERCONNECTS;

MULTI-LAYER PACKAGING;

LIQUID CRYSTAL POLYMERS;

EID: 0041589472     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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2. A. Pham, R. Ramachandran, J. Laskar, V. Krishnamurthy, D. Bates, W. Marcinkewicz, B. Schmanski, P. Piacente, and L. Sprinceanu, "Development of a millimeter wave system on a package utilizing an MCM process," IEEE Trans. on Microwave Theory and Techniques, pp. 1747-1749, Oct. 2001.
3. A. Pham, A. Sutono, J. Laskar, V. Krishnamurthy, D. Lester, E. Balch, and J. Rose, "Development of microwave multi-layer plastic-based multi-chip modules," IEEE Trans. on Advanced Packaging, pp. 37-40, Feb. 2001.
4. A. Pham, J. Laskar, V. Krishnamurthy, H. Cole, and T. Sitnik-Nieters, "Ultra low loss millimeter wave multichip module interconnects," IEEE Trans. on CPMT, vol. 21, pp. 302-308, August 1998.
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