Characterisation of TFMS lines fabricated using photoimageable thick-film technology

IEE Proceedings: Microwaves, Antennas and Propagation

Volumn 150, Issue 3, 2003, Pages 125-130

  Ng, C Y ^a   Chongcheawchamnan, M ^b   Aftanasar, M S ^a   Robertson, I D ^a   Young, P R ^c   Minalgiene, J ^d  

^a UNIVERSITY OF SURREY   (United Kingdom)

^b Mahanakorn University   (Thailand)

^c UNIVERSITY OF KENT   (United Kingdom)

^d Hibridas Enterprise   (Lithuania)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; ELECTRIC CONDUCTORS; ELECTRIC LINES; ELECTRIC PROPERTIES; INTEGRATED CIRCUIT LAYOUT; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; SCREEN PRINTING; THIN FILM DEVICES;

MINIATURIZED HYBRID COUPLERS; PHOTOIMAGEABLE THICK FILM TECHNOLOGY; THIN FILM MICROSTRIP LINES;

MICROSTRIP ANTENNAS;

EID: 0038148527     PISSN: 13502417     EISSN: None     Source Type: Journal    
DOI: 10.1049/ip-map:20030413     Document Type: Article

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