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IEEE Transactions on Advanced Packaging

Volumn 25, Issue 1, 2002, Pages 79-91

The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

(5) Schwab, Daniel J b Randall, Barbara b Zabinski, Patrick J b Schaefer, Timothy M b Gilbert, Barry K a,b

a IEEE

b MAYO CLINIC (United States)

Author keywords

Digital receiver; MCM L; S parameter measurements; Transmission lines; Wire bonds

Indexed keywords

DIGITAL CIRCUITS; DIGITAL SIGNAL PROCESSING; ELECTRIC LINES; ELECTRONICS PACKAGING; FREQUENCIES; LAMINATES; PRINTED CIRCUIT BOARDS; RADAR RECEIVERS;

DIGITAL MULTICHIP CIRCUITS;

MULTICHIP MODULES;

EID: 0036478887 PISSN: 15213323 EISSN: None Source Type: Journal
DOI: 10.1109/TADVP.2002.1017689 Document Type: Conference Paper

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.