Novel thick film on ceramic MCM technology offering MCM-D performance

Proceedings of SPIE - The International Society for Optical Engineering

Volumn , Issue , 1997, Pages 48-52

  Barnwell, Peter ^a   Wood, Jim ^a  

^a Heraeus Incorporated Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST EFFECTIVENESS; DIELECTRIC FILMS; INTEGRATED CIRCUIT MANUFACTURE; PERMITTIVITY; STANDARDS; SUBSTRATES; THICK FILM CIRCUITS;

CERAMIC MULTICHIP MODULE TECHNOLOGY;

MULTICHIP MODULES;

EID: 0031337157     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)