FODEL(R) photoimageable technology in microwave applications

12th International Conference on Microwaves and Radar, MIKON 1998

Volumn 2, Issue , 1998, Pages 445-450

  Dziurdzia, B ^a   Nowak, S ^b  

^a Research and Development Center for Hybrid Microelectronics and Resistors   (Poland)

^b AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

MICROWAVES; RADAR; THICK FILMS;

CIRCUIT TECHNOLOGY; HIGH-VOLUME PRODUCTION; MICROWAVE APPLICATIONS; MICROWAVE PERFORMANCE; PHOTO PATTERNING; THICK FILM TECHNOLOGY; THICK-FILM MATERIALS; THIN-FILM TECHNIQUE;

THIN FILMS;

EID: 29544436269     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MIKON.1998.740821     Document Type: Conference Paper

References (4)

1. P. Barnwel1, J. Wood, "Advanced Thick-film Technology-The New Generation", Microelectronics
2. D. Amey, S. J. Horowitz "Microwave Material Characterization", Proc. Inter. Symp. on Microelectronics,
3. E. Polzer "FODELR Photoprintable Thick Film", DuPont Application note1996.
4. Manier.V. , Sockeel.O. , Gauthier.J. , Suess.T. , "FODELB, Photoprintable Thick Film Technology in International No.44, Sept.1997, p.51-53, Minneapolis, 1996, p.494-499, Microwave Applications", Microwave Conference 1994, Rennes.