Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 994-1000

  Fan, X J ^a   Wang, H B ^a   Lim, T B ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DATA PROCESSING; DELAMINATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFACES (MATERIALS); PEELING; STRESS INTENSITY FACTORS; STRESSES; THERMAL CYCLING;

BIMATERIAL WEDGE; FLIP CHIP MODULES; MAXIMUM HOOP STRESS CRITERION; SOLDER BALLS; STRESS SINGULARITY; UNDERFILL DELAMINATION;

MULTICHIP MODULES;

EID: 0032659968     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)