The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 362-370

  Rzepka, S ^a   Feustel, F ^a   Meusel, E ^a   Korhonen, M A ^b   Li, Che Yu ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b Dept of Materials Science and Engineering ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; INCLUSIONS; MECHANICAL PROPERTIES; NETWORK COMPONENTS; RELIABILITY ANALYSIS; STRESS ANALYSIS; COMPUTER SIMULATION; DELAMINATION; FLIP CHIP DEVICES; IMPURITIES; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EFFECTS;

CHEMICAL EFFECT; DAMAGING EFFECTS; EXPERIMENTAL TEST; FEM SIMULATIONS; FLUX RESIDUES; HARD MATERIAL; NEUTRAL POINTS; THERMAL CYCLIC LOADS;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

FLIP CHIP MODULES; UNDERFILL IMPERFECTIONS;

EID: 0031629078     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678719     Document Type: Conference Paper

References (11)

1. Rzepka, S., Waidhas, B., C4 Flip Chip Modules with Flexible Substrates: FEM Simulations and Experimental Investigations, First International Symposium on Flip Chip Technology (ITAB 94), Feb 15-17, 94, San Jose/CA, USA, proc. pp 142-49
2. Wu, T:Y., Tsukada, Y., Chen, W. T., Materials and Mechanics Issues in Flip-Chip Organic Packaging, Proc. 1996 ECTC, pp. 524-34
3. Rzepka, S., Waidhas, B., Meusel, E., Adhesive Stabilized and Pure Flip Chips on Various Substrates Under Thermocycling, Microsystems Technologies vol. 1, no. 3 (July 1995), pp. 129-36
4. Rzepka, S., Meusel, E., Flip Chips Directly Attached to FR4 Printed Circuit Boards: FEM Simulations and Experimental Tests, Sixth International TAB/Advanced Packaging Symposium (ITAB 95), Feb 14-17, 95, San Jose/CA, USA
5. Gilmour, D. A., Reilly, J. F., Calabrese, D. W., Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical analysis Data for Die Attachment Analysis, Application of Fracture Mechanics to Electronic Packaging AS ME 1997, AMD-Vol. 222/EEP-Vol. 20, pp. 175-81
6. Cotts, E., Lehmann, G., Singler, T., Underfill Process Development: Annual Report, Binghampton University, Depts. of Physic and Mechanical Engineering, 1997, p. 41
7. Rzepka, S. Korhonen, M. A., Meusel, E., Li, C.-Y., The Effect of Underfill Delamination on the Reliability of Flip Chip Modules, Application of Fracture Mechanics to Electronic Packaging ASM E 1997, AMD-Vol. 222/EEP-Vol. 20, pp. 73-83
8. Pan, T.-Y, Thermal Cyclic Induced Plastic Deformation in Solder joints-Part II: Accumulated Deformation in Through Hole Joints, IEEE Trans CHMT, vol. 14, no. 2 (Dec 1991), pp. 824-32
9. Schwarzl, F. R., Polymermechanik-Struktur und mechanisches Verhalten von Polvmei-en, Springer Verlag Berlin Heidelberg New York, 1990, p. 123
10. Hu, J. M., Interfacial Stress Singularity Analysis-A Case Study for Plastic Encapsulated IC Packages, Application of Fracture Mechanics in Electronic Packaging and Materials ASME 1995, EEP-vol. 11/MD-vol. 64, pp. 13-23
11. Quian, Z., Lu, M., Wang, J, Liu, S., Testing and Constitutive Modeling of Polymer Films and Underfills by 6-axis Submi-cron Tester, Application of Experimental Mechanics to Elec tronic Packaging ASME 1997, AMD-Vol. 226/EEP-Vol. 22, pp. 105-12