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Volumn 19, Issue 6, 2005, Pages 14-
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Bismuth in lead-free systems - Not to fear
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
COMPOSITION;
CRACK PROPAGATION;
ELECTRONIC EQUIPMENT;
HEALTH RISKS;
LEAD;
LOW TEMPERATURE EFFECTS;
SOLDERED JOINTS;
STRESSES;
THERMODYNAMICS;
WETTING;
ELECTRONIC SOLDERS;
FILLET LIFTING;
LEAD-FREE SOLDER JOINTS;
SOLDERING PROCESSES;
BISMUTH ALLOYS;
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EID: 21644449967
PISSN: 15298930
EISSN: None
Source Type: Journal
DOI: None Document Type: Short Survey |
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Times cited : (3)
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References (1)
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