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Volumn 6518, Issue PART 3, 2007, Pages

New inline AFM metrology tool suited for LSI manufacturing at the 45-nm node and beyond

Author keywords

AFM; Carbon nanotube; CMP; Etching; High aspect ratio; Inline metrology; Lithography; Microlens; Roughness; SPM

Indexed keywords

ATOMIC FORCE MICROSCOPY; CARBON NANOTUBES; ETCHING; LITHOGRAPHY; LSI CIRCUITS; MICROLENSES; PHOTORESISTORS; PROBES;

EID: 35148882631     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.711676     Document Type: Conference Paper
Times cited : (7)

References (12)
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  • 6
    • 33745603171 scopus 로고    scopus 로고
    • CD-AFM vs CD-SEM for resist LER and LWR measurements
    • J. Foucher, A. L. Fabre, and P. Gautier, "CD-AFM vs CD-SEM for resist LER and LWR measurements", Proc. SPIE 6152, 61520V (2006).
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    • Foucher, J.1    Fabre, A.L.2    Gautier, P.3
  • 7
    • 33748424837 scopus 로고    scopus 로고
    • Current Status and Outlook of 3D Inspection Analysis for Semiconductor Devices
    • A.Sugimoto, Y. Kembo, K. Watanabe, and T. Yaguchi, "Current Status and Outlook of 3D Inspection Analysis for Semiconductor Devices", Hitachi Review 55, 56-60 (2006).
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    • Sugimoto, A.1    Kembo, Y.2    Watanabe, K.3    Yaguchi, T.4
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    • An Advanced AFM Sensor for High-Aspect Ratio Pattern Profile In-line Measurement
    • M. Watanabe, S. Baba, T. Nakata, T. Kurenuma, H. Kuroda, and T. Hiroki, "An Advanced AFM Sensor for High-Aspect Ratio Pattern Profile In-line Measurement", Proc. SPIE 6152, 61552A (2006).
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    • Watanabe, M.1    Baba, S.2    Nakata, T.3    Kurenuma, T.4    Kuroda, H.5    Hiroki, T.6
  • 9
    • 0141500225 scopus 로고    scopus 로고
    • New atomic force microscope method for critical dimension metrology
    • T. Morimoto, T. Shinaki, Y. Kembo, and S. Hosaka, "New atomic force microscope method for critical dimension metrology", Proc. SPIE 5038, 636-643 (2003).
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    • Morimoto, T.1    Shinaki, T.2    Kembo, Y.3    Hosaka, S.4
  • 10
    • 0141720403 scopus 로고    scopus 로고
    • B. C. Park, J. Kang, K. Y. Jung, W. Y. Song, B.-h. O, and T. B. Eom, Atomic force microscopy of steep sidewalled feature with carbon nanotube tip, Proc. SPIE 5038, 935 (2003).
    • B. C. Park, J. Kang, K. Y. Jung, W. Y. Song, B.-h. O, and T. B. Eom, "Atomic force microscopy of steep sidewalled feature with carbon nanotube tip", Proc. SPIE 5038, 935 (2003).
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    • L. Yu, F. E. H. Tay, G. Xu, B. Chen, M. Avram, and C. Iliescu, Adhesive Bonding with SU-8 at Wafer Level for Microfluidic Devices, J. Phys. Conference Series 34, 776-781 (2006).
    • L. Yu, F. E. H. Tay, G. Xu, B. Chen, M. Avram, and C. Iliescu, "Adhesive Bonding with SU-8 at Wafer Level for Microfluidic Devices", J. Phys. Conference Series 34, 776-781 (2006).
  • 12
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    • Die-scale wafer flatness: 3D imaging across 20 mm with nanometer-scale resolution
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.