Initial experience establishing a EUV baseline lithography process for manufacturability assessment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6517, Issue PART 1, 2007, Pages

  Wood II, O R ^a   Back, D ^b   Brainard, R ^c   Denbeaux, G ^c   Goldfarb, D ^d   Goodwin, F ^b   Hartley, J ^c   Kimmel, K ^e   Koay, C ^e   La Fontaine, B ^a   Mackey, J ^f   Martinick, B ^b   Montgomery, W ^c   Naulleau, P ^c   Okoroanyanwu, U ^a   Petrillo, K ^e   Pierson, B ^g   Tittnich, M ^c   Trogisch, S ^h   Wallow, T ^a   Wei, Y ^b   more..

^a ADVANCED MICRO DEVICES   (United States)

^b Qimonda North America   (United States)

^c STATE UNIVERSITY OF NEW YORK   (United States)

^d IBM T J WATSON RESEARCH CENTER   (United States)

^e IBM   (United States)

^f MICRON TECHNOLOGY INC   (United States)

^g ASML US Inc   (United States)

^h QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

Author keywords

EUV resists; EUV reticle contamination; EUV reticles; EUVL; Extreme ultraviolet lithography

Indexed keywords

BASELINE LITHOGRAPHY; RESIST MATERIALS;

DIGITAL INTEGRATED CIRCUITS; MICROSCOPES; RESEARCH AND DEVELOPMENT MANAGEMENT;

EXTREME ULTRAVIOLET LITHOGRAPHY;

EID: 35148870833     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.714016     Document Type: Conference Paper

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