Fatigue of chip scale package interconnects due to cyclic bending

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 302-308

  Shetty, S ^a   Lehtinen, V ^a   Dasgupta, A ^a   Halkola, V ^b   Reinikainen, T ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038970549     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1362673     Document Type: Article

References (8)

1. Lau, J. H., and Pao Y., 1997. Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies. McGraw Hill, NY.
2. Lau, J. H., and Lee, Ricky S-W., 1999. Chip Scale Package: Design, Materials Processes and Applications, McGraw Hill, NY.
3. Schueller R. D., Bradley E. A., and Harvey P. M., 1999, "Meeting the Cost/Performance Requirements of Flex-Based Chip-Scale Packages," Chip Scale Review, Jan. Feb.
4. BPA Group Ltd., 1998, "Technology Update No. 3," p. 2, Feb.
5. Shetty S., 2000. "Effect Of Cyclic Bending On Chip Scale Package Assemblies," MS thesis, Dept. of Mechanical Engineering, University of Maryland, College Park.
6. Coffin, L. F., 1954, "A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal," Trans. ASME, 76, pp. 931-950.
7. Morrow J. D., 1965. "Cyclic Plastic Strain Energy and Fatigue of Metals," Internal Friction, Damping and Cyclic Plasticity, ASTM-STP, pp. 45-87.
8. Upadhyayula, K., 1999. "An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability under Combined Temperature and Vibration Environments," Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.