IMC consideration in FEA simulation for PB-free solder joint reliability

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1018-1023

  Che, Fa Xing ^a   Pang, John H L ^a   Xu, L H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

IMC modeling; Lead free solder; Nano indentation results of IMC; Sn Ag Cu; Thermal fatigue

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; JOINTS (STRUCTURAL COMPONENTS); MATHEMATICAL MODELS; RELIABILITY THEORY; WEIBULL DISTRIBUTION;

IMC MODELING; LEAD FREE SOLDER; THERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 33845584923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645456     Document Type: Conference Paper

References (16)

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