Moisture related low-k dielectric reliability before and after thermal annealing

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2007, Pages 405-409

  Yunlong, Li ^a,b   Ciofi, Ivan ^a   Carbonell, Laureen ^a   Groeseneken, Guido ^a,b   Maex, Karen ^a,b   Tokei, Zsolt ^a  

^a IMEC   (Belgium)

^b Katholieke Universiteit Leuven   (Belgium)

Author keywords

Leakage; Low k dielectric reliability; Moisture uptake; Plasma modification; TDDB; TDS; Thermal activation energy; Thermal annealing; TVS

Indexed keywords

ACTIVATION ENERGY; LEAKAGE CURRENTS; MOISTURE DETERMINATION; OPTIMIZATION; PLASMA THEORY; RAPID THERMAL ANNEALING;

LOW-K DIELECTRIC RELIABILITY; MOISTURE UPTAKE; PLASMA MODIFICATION; THERMAL ACTIVATION ENERGY;

DIELECTRIC HEATING;

EID: 34548743500     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2007.369923     Document Type: Conference Paper

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