Water and copper contamination in SiOC:H damascene: Novel characterization methodology based on triangular voltage sweep measurements

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 181-183

  Ciofi, Ivan ^a   Tökei, Zsolt ^a   Visalli, Domenica ^a   Van Hove, Marleen ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DEGRADATION; OPTICAL INTERCONNECTS; SULFATE MINERALS; TECHNOLOGY;

COPPER CONTAMINATION; CU INTERCONNECTS; DEGRADATION MECHANISMS; DISTINCTIVE FEATURES; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; SUB-100 NM; VOLTAGE SWEEP;

COPPER;

EID: 34548763526     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648682     Document Type: Conference Paper

References (3)

1. M. Kuhn, et al., J. Electrochem. Soc., 118, 966, 1971
2. N. Lifshitz, et. al., Appl. Phys. Lett., 55, 408, 1989
3. I. Ciofi, et. al., Accepted for MRS Spring Meeting, 2006