Forming tapered pattern by Cu electrodeposition through mask on Ni seed layer for thin-film transistors

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 45, Issue 42-45, 2006, Pages

  Jenq, Shrane Ning ^a   Wan, Chi Chao ^a   Wang, Yung Yun ^a   Li, Hung Wei ^b   Liu, Po Tsun ^b   Chen, Jing Hon ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c AU OPTRONICS CORPORATION   (Taiwan)

Author keywords

Acid pretreatment; Cu; Electrodeposltion; Ni seed layer; Thin film transistors

Indexed keywords

ADHESION; ELECTRODEPOSITION; GATES (TRANSISTOR); MULTILAYERS; NICKEL; SULFUR COMPOUNDS;

ACID PRETREATMENT; NICKEL LAYERS; SELECTIVE ETCHING;

THIN FILM TRANSISTORS;

EID: 34548717684     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.L1215     Document Type: Article

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