Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

IEEE Transactions on Device and Materials Reliability

Volumn 5, Issue 2, 2005, Pages 212-216

  Tung, Chih Hang ^a   Teo, Poi Siong ^a   Lee, Charles ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

Intermetallic; Lead free solder; Packaging; Reliability; Transmission electron microscopy (TEM); Under bump metallization (UBM)

Indexed keywords

LEAD-FREE SOLDERS; MECHANICAL INTERLOCKING; UBM SYSTEMS; UNDER BUMP METALLIZATION (UBM);

ELECTRONICS PACKAGING; EUTECTICS; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; METALLIZING; MICROELECTRONICS; MICROSTRUCTURE; NICKEL ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

SOLDERING ALLOYS;

EID: 23844511554     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2005.846978     Document Type: Conference Paper

References (3)

1. C. H. Tung, G. T. T. Sheng, and C. Y. Lu, ULSI Semiconductor Technology Atlas. New York: Wiley Interscience, 2003.
2. T. T. Chun, T. C.Hang Chun, and C. T. Chong, "Investigation of microstructure change on Ni-based UBM systems in Pb-free solder," in Proc. 28th Int. Symp. Testing and Failure Analysis (ISTFA), Nov. 2002, pp. 127-132.
3. C.-H. Tung, G. T. T. Sheng, P. S. Teo, and C. Y. Lo, "On the microstructure strudies of under bump metallization systems using TEM," in Proc. 28th Int. Symp. Testing and Failure Analysis (ISTFA), Nov. 2002, pp. 505-511.