BGA Jointing Property of Sn-8.8 mass% Zn and Sn-8.0 mass% Zn-3.0 mass% Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates

Materials Transactions

Volumn 44, Issue 9, 2003, Pages 1790-1796

  Sugizaki, Takashi ^a,c   Nakao, Hidehiro ^a   Kimura, Takashi ^b   Watanabe, Tohru ^c  

^a Meltex Incorporation   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c TOKYO METROPOLITAN UNIVERSITY   (Japan)

Author keywords

Interfacial structure; Joint strength; Tin zinc solder; Tin zinc bismuth solder

Indexed keywords

ELECTROLESS PLATING; GOLD; INTERFACES (MATERIALS); INTERMETALLICS; THERMAL EFFECTS;

SURFACE FINISHING;

SOLDERING ALLOYS;

EID: 0242721297     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.44.1790     Document Type: Article

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