Reliability evaluation and failure analysis for NTC thermistor

International Journal of Modern Physics B

Volumn 17, Issue 8-9 I, 2003, Pages 1254-1260

  Jung, Oon Sik ^a   Kim, In Woo ^a   Kim, Yung Soo ^b   Jang, Oong Soon ^c   Ryu, Ong Su ^a  

^a Daewoo Electronics Co   (South Korea)

^b Suwon University   (South Korea)

^c Ajou University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GLASS; POLYVINYLCHLORIDE;

CONFERENCE PAPER; ELECTRIC POTENTIAL; ELECTRICITY; EVALUATION; HUMIDITY; MATERIAL COATING; PARAMETER; RELIABILITY; TEMPERATURE; THERMISTOR;

EID: 0038778440     PISSN: 02179792     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0217979203018831     Document Type: Conference Paper

References (9)

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