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Volumn 2005, Issue , 2005, Pages 238-244

Electrochemical migration of land grid array sockets under highly accelerated stress conditions

Author keywords

Dendrite; HAST; Interconnect; Silver electrochemical migration; Socket; Surface insulation resistance (SIR)

Indexed keywords

HAST; INTERCONNECT; SILVER ELECTROCHEMICAL MIGRATION; SURFACE INSULATION RESISTANCE (SIR);

EID: 33747438925     PISSN: 03614395     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (17)

References (31)
  • 3
    • 33747428527 scopus 로고
    • Electrical-conductivity mechanism of anisotropic metal-filled polymeric matierals
    • M.G. Golueva, N.N. Turkova, L.Z. Shenfil, and V.E. Gul, "Electrical-Conductivity Mechanism of Anisotropic Metal-Filled Polymeric Matierals," Colloid Journal of the VSSR, Vol.35, No.4, 1973, pp.691-693.
    • (1973) Colloid Journal of the VSSR , vol.35 , Issue.4 , pp. 691-693
    • Golueva, M.G.1    Turkova, N.N.2    Shenfil, L.Z.3    Gul, V.E.4
  • 5
    • 0024734446 scopus 로고
    • Characterization of metal-in-elastomer connector contact material
    • Chicago, IL, USA, Sep.18-20
    • th Holm Conference on Electrical Contacts, Chicago, IL, USA, Sep.18-20, 1989, pp.117-128.
    • (1989) th Holm Conference on Electrical Contacts , pp. 117-128
    • Haque, C.A.1
  • 8
    • 0035441283 scopus 로고    scopus 로고
    • Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system
    • September
    • W. Liu, M. Pecht, J. Xie, "Fundamental Reliability Issues Associated with a Commercial Particle-in-Elastomer Interconnection System", IEEE Transactions on Components and Packaging Technologies, Vol.24, No.3, September 2001, pp.520-525.
    • (2001) IEEE Transactions on Components and Packaging Technologies , vol.24 , Issue.3 , pp. 520-525
    • Liu, W.1    Pecht, M.2    Xie, J.3
  • 9
    • 3042844000 scopus 로고    scopus 로고
    • An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses
    • June
    • W. Liu, M. Pecht, R. Martens, "An Investigation of the Contact Resistance of a Commercial Elastomer Interconnect Under Thermal and Mechanical Stresses", IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 2, June 2003, pp.39-43.
    • (2003) IEEE Transactions on Device and Materials Reliability , vol.3 , Issue.2 , pp. 39-43
    • Liu, W.1    Pecht, M.2    Martens, R.3
  • 10
    • 33747380013 scopus 로고    scopus 로고
    • IPC Publication IPC-9201, Northbrook, IL, July
    • IPC Publication IPC-9201, Surface Insulation Resistance Handbook, Northbrook, IL, July 1996.
    • (1996) Surface Insulation Resistance Handbook
  • 11
    • 0016552288 scopus 로고
    • Silver migration in glass dams between silver palladium interconnections
    • September
    • G.J. Kahan, "Silver Migration in Glass Dams between Silver Palladium Interconnections," IEEE Transactions on Electrical Insulation, Vol.EI-10, September 1975, pp.86-94.
    • (1975) IEEE Transactions on Electrical Insulation , vol.EI-10 , pp. 86-94
    • Kahan, G.J.1
  • 12
  • 14
    • 0018482162 scopus 로고
    • Silver migration and the reliability of Pd/Ag conductors in thick-film dielectric crossover structures
    • June
    • H.M. Naguib and B.K. MacLaurin, "Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.CHMT-2, No.2, June 1979, pp. 196-207.
    • (1979) IEEE Transactions on Components, Hybrids, and Manufacturing Technology , vol.CHMT-2 , Issue.2 , pp. 196-207
    • Naguib, H.M.1    MacLaurin, B.K.2
  • 17
  • 20
    • 0019682068 scopus 로고
    • Electrochemical model for corrosion of conductors on ceramic substrates
    • Dec.
    • R.T. Howard, "Electrochemical Model for Corrosion of Conductors on Ceramic Substrates," IEEE Transactions on Components, Hybrids, Manufacturing Technology, Vol.4, No.4, Dec. 1981, pp.520-525.
    • (1981) IEEE Transactions on Components, Hybrids, Manufacturing Technology , vol.4 , Issue.4 , pp. 520-525
    • Howard, R.T.1
  • 21
    • 0020297175 scopus 로고
    • Metal migration (Ag, Cu, Pb) in encapsulated modules and time-to-fail model as a function of the environment and package properties
    • San Diego, CA, Mach 30-31
    • th International Reliability Physics Symposium, San Diego, CA, Mach 30-31, 1982, pp.27-33.
    • (1982) th International Reliability Physics Symposium , pp. 27-33
    • Digiacomo, G.1
  • 30
    • 0036505677 scopus 로고    scopus 로고
    • Humidity management of outdoor electronic equipment: Methods, pitfalls, and recommendations
    • March
    • M. Tencer and J.S. Moss, "Humidity Management of Outdoor Electronic Equipment: Methods, Pitfalls, and Recommendations," IEEE Transaction on Components and Packaging Technologies, Vol.25, No.l, March 2002, pp.66-72.
    • (2002) IEEE Transaction on Components and Packaging Technologies , vol.25 , Issue.50 , pp. 66-72
    • Tencer, M.1    Moss, J.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.