The effect of migration in electrochemical deposition on a horizontal plate

Journal of Physics D: Applied Physics

Volumn 31, Issue 10, 1998, Pages 1137-1143

  Shitamoto, H ^a   Nagatani, T ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; DIFFUSION; ELECTROCHEMICAL ELECTRODES; ELECTRODEPOSITION; IONS; MORPHOLOGY; REDUCTION; SILVER; SILVER COMPOUNDS; SOLUTIONS;

DIFFUSION LIMITED AGGREGATION; ELECTRODELESS REDUCTION; MORPHOLOGICAL TRANSITION;

ELECTROMIGRATION;

EID: 11744387561     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/31/10/002     Document Type: Article

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