METAL MIGRATION (Ag, Cu, Pb) IN ENCAPSULATED MODULES AND TIME-TO-FAIL MODEL AS A FUNCTION OF THE ENVIRONMENT AND PACKAGE PROPERTIES.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1982, Pages 27-33

  DiGiacomo, Giulio ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DENDRITIC GROWTH AND FAILURE; FACTORS INFLUENCING MIGRATION; IONIC MIGRATION MODEL; PREDICTION OF FAILURE; VERIFICATION OF FAILURE PREDICTIONS;

METALS AND ALLOYS;

EID: 0020297175     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1982.363018     Document Type: Conference Paper

References (0)