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Volumn 9, Issue 4, 1986, Pages 403-409

Current-Leakage Failures in Hybrid Microcircuits

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FAULT CURRENTS - LEAKAGE CURRENTS; ELECTRONICS PACKAGING - CONTAMINATION; FAILURE ANALYSIS; SPECTROSCOPY, AUGER ELECTRON;

EID: 0023011995     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1986.1136664     Document Type: Article
Times cited : (9)

References (18)
  • 1
    • 85041176079 scopus 로고
    • Silicon transistor failure mechanisms caused by surface charge separation
    • E. D. Metz, “Silicon transistor failure mechanisms caused by surface charge separation,” in Proc. Physics of Failure in Electronics Symp., vol. 2, 1963, p. 163.
    • (1963) Proc. Physics of Failure in Electronics Symp. , vol.2 , pp. 163
    • Metz, E.D.1
  • 4
    • 3242832967 scopus 로고
    • Bias-humidity performance of encapsulated and unencapsulated Ti-Pd-Au thin film conductors in an environment contaminated with Cl2
    • N. L. Sbar, “Bias-humidity performance of encapsulated and unencapsulated Ti-Pd-Au thin film conductors in an environment contaminated with Cl2,” in Proc. 26th Electronic Components Conf., 1976, p. 277.
    • (1976) Proc. 26th Electronic Components Conf. , pp. 277
    • Sbar, N.L.1
  • 8
    • 84939046375 scopus 로고
    • Design guidelines for hybrid microcircuits: Organic adhesives for hybrid microcircuits
    • NASA-CR-144011
    • K. L. Perkins and J. J. Licari, “Design guidelines for hybrid microcircuits: Organic adhesives for hybrid microcircuits,” NASA-CR-144011, 1975, p. 101.
    • (1975) , pp. 101
    • Perkins, K.L.1    Licari, J.J.2
  • 9
    • 84938017989 scopus 로고
    • Aging characteristics of electrically conductive adhesives
    • N. J. DeLollis, “Aging characteristics of electrically conductive adhesives,” in Proc. 21st Nat. SAMPE Symp., 1976, p. 565.
    • (1976) Proc. 21st Nat. SAMPE Symp. , pp. 565
    • DeLollis, N.J.1
  • 10
    • 0019581158 scopus 로고
    • Migration of silver from silver-loaded polyimide adhesive chip bonds at high temperatures
    • R. J. Chaffin, “Migration of silver from silver-loaded polyimide adhesive chip bonds at high temperatures,” IEEE Trans. Components, Hybrids, Manuf. Technol., vol. CHMT-4, p. 214, 1981.
    • (1981) IEEE Trans. Components, Hybrids, Manuf. Technol. , vol.CHMT-4 , pp. 214
    • Chaffin, R.J.1
  • 12
    • 0015725405 scopus 로고
    • Evaluation of electrically insulative adhesives for use in hybrid microcircuit fabrication
    • J. J. Licari, K. L. Perkins, and S. V. Caruso, “Evaluation of electrically insulative adhesives for use in hybrid microcircuit fabrication,” IEEE Trans. Parts, Hybrids, Package, vol. PHP-9, p. 199, 1973.
    • (1973) IEEE Trans. Parts, Hybrids, Package , vol.PHP-9 , pp. 199
    • Licari, J.J.1    Perkins, K.L.2    Caruso, S.V.3
  • 13
    • 0018048707 scopus 로고
    • Mass changes of adhesives during curing, exposure to water vapor, evacuation, and outgassing, part I: Ablefilms 529, 535, and 550
    • R. W. Vasofsky, A. W. Czanderna, and K. K. Czanderna, “Mass changes of adhesives during curing, exposure to water vapor, evacuation, and outgassing, part I: Ablefilms 529, 535, and 550,” IEEE Trans. Components, Hybrids, Manuf. Technol., vol. CHMT-1, p. 405, 1978.
    • (1978) IEEE Trans. Components, Hybrids, Manuf. Technol. , vol.CHMT-1 , pp. 405
    • Vasofsky, R.W.1    Czanderna, A.W.2    Czanderna, K.K.3
  • 14
    • 0020943586 scopus 로고
    • Epoxy characterization and testing using mechanical, electrical, and surface analysis techniques
    • E. S. Dettmer et al., “Epoxy characterization and testing using mechanical, electrical, and surface analysis techniques,” Int. J. Hybrid Microelectron., vol. 6, p. 375, 1983.
    • (1983) Int. J. Hybrid Microelectron. , vol.6 , pp. 375
    • Dettmer, E.S.1
  • 15
    • 0021412987 scopus 로고
    • Surface analysis of adsorbed species from epoxy adhesives used in microelectronics
    • R. C. Benson, B. H. Nail, F. G. Satkiewicz, and H. K. Charles, Jr., “Surface analysis of adsorbed species from epoxy adhesives used in microelectronics,” Appl. Surf. Sci., vol. 21, p. 219, 1985.
    • (1985) Appl. Surf. Sci. , vol.21 , pp. 219
    • Benson, R.C.1    Nail, B.H.2    Satkiewicz, F.G.3    Charles, H.K.4
  • 16
    • 0022246012 scopus 로고
    • The identification and elimination of human contamination in the manufacture of IC's
    • R. W. Thomas and D. W. Calabrese, “The identification and elimination of human contamination in the manufacture of IC's,” in Proc. 23rd Int. Reliability Physics Symp., 1985, p. 228.
    • (1985) Proc. 23rd Int. Reliability Physics Symp. , pp. 228
    • Thomas, R.W.1    Calabrese, D.W.2
  • 17
    • 67649644744 scopus 로고
    • Heat aging characteristics of polyimide chip adhesives
    • S. P. Anderson and H. S. Kraus, “Heat aging characteristics of polyimide chip adhesives,” Int. J. Hybrid Microelectron., vol. 4, p. 190, 1981.
    • (1981) Int. J. Hybrid Microelectron. , vol.4 , pp. 190
    • Anderson, S.P.1    Kraus, H.S.2
  • 18
    • 0020204463 scopus 로고
    • Long-term vs. short-term thermal stability of polyimide die attach adhesives
    • J. C. Bolger, “Long-term vs. short-term thermal stability of polyimide die attach adhesives,” Int. J. Hybrid Microelectron., vol. 5, 1982, p. 496.
    • (1982) Int. J. Hybrid Microelectron. , vol.5 , pp. 496
    • Bolger, J.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.