Accelerated tests to simulate metal migration in hybrid circuits

Proceedings of the Annual Reliability and Maintainability Symposium

Volumn , Issue , 2002, Pages 319-324

  Bhakta, Satish D ^a   Lundberg, Scott ^a   Mortensen, Gary ^a  

^a Itron Inc   (United States)

Author keywords

Ag migration; Pd Ag; Thick films

Indexed keywords

COMPUTER SIMULATION; HYBRID INTEGRATED CIRCUITS; IMPURITIES; PALLADIUM; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; RELIABILITY; SILVER; SODIUM CHLORIDE; THICK FILMS; WEIBULL DISTRIBUTION;

ACCELERATED TESTS; COUPON TESTS; METAL MIGRATION; WEIBULL CURVES;

PRINTED CIRCUIT TESTING;

EID: 0036131082     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

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