Tin whisker formation - A stress relieve phenomenon

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 348-359

  Dittes, M ^a   Oberndorff, P ^b   Crema, P ^c   Su, P ^d  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b NXP SEMICONDUCTORS   (Netherlands)

^c STMICROELECTRONICS   (Italy)

^d FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Corrosion; Electronics packaging; Intermetallics; Plating; Thermal cycling; Tin whisker

Indexed keywords

EID: 33751255982     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173568     Document Type: Conference Paper

References (14)

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