Microstructure development of mechanical-deformation-induced Sn whiskers

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1732-1734

  Lin, Shih Kang ^a,b   Yorikado, Yuhi ^b   Jiang, Junxiang ^b   Kim, Keun Soo ^b   Suganuma, Katsuaki ^b   Chen, Sinn Wen ^a   Tsujimoto, Masanobu ^c   Yanada, Isamu ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b OSAKA UNIVERSITY   (Japan)

^c Central Research and Development Laboratory   (Japan)

Author keywords

FIB; Grain boundary diffusion; Microstructure; Sn whiskers

Indexed keywords

ELECTROPLATED FILMS; GRAIN BOUNDARY DIFFUSION; MECHANICAL DEFORMATION; TIN WHISKERS;

CRYSTAL WHISKERS; ELECTROPLATED PRODUCTS; FOCUSED ION BEAMS; GRAIN BOUNDARY SLIDING; RECRYSTALLIZATION (METALLURGY); STRESS RELAXATION; TIN;

MICROSTRUCTURAL EVOLUTION;

EID: 34547107993     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0284-4     Document Type: Article

References (8)

1. G.T. Galyon, IEEE T. Electron. Pa. M. 28 (2005) 94
2. B.-Z. Lee, D.N. Lee, Acta Mater. 46 (1998) 3701
3. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, G.R. Stafford, Acta Mater. 53 (2005) 5033
4. W.J. Choi, G. Galyon, K.N. Tu, and T.Y. Lee, Handbook of Lead-free Solder Technology for Microelectronic Assemblies, ed. K.J. Puttlitz and K.A. Stalter (Marcel Dekker Inc., New York, 2004), pp. 851-914
5. Y. Yorikado, K.-S. Kim, K. Suganuma, M. Tsujimoto, and I. Yanada, in preparation for publication (2007)
6. S.-K. Lin, J. Jiang, Y. Yorikado, K.-S. Kim, K. Suganuma, S.-W. Chen, M. Tsujimoto, and I. Yanada, J. Mater. Res. 22, 1975 (2007)
7. C.A. Harper, Electronic Packaging and Interconnection Handbook, 3rd ed., McGraw-Hill, New York, 2000
8. W.R. Runyan, Silicon Semiconductor Technology, MiGraw-Hill, New York, 1965