Resonant Vibration Behavior of Lead-Free Solders

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1501-1508

  Song, J M ^a   Lui, T S ^a   Chen, L H ^a   Tsai, D Y ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Damping capacity; Lead free solder; Resonant vibration

Indexed keywords

CRACK PROPAGATION; DAMPING; DEFORMATION; FATIGUE OF MATERIALS; FRACTURE; LEAD; MICROSTRUCTURE; MORPHOLOGY; SILVER; TIN ALLOYS;

DAMPING CAPACITY; LEAD-FREE SOLDER; RESONANT VIBRATION;

SOLDERING ALLOYS;

EID: 0942266957     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0121-3     Document Type: Conference Paper

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