Effect of Zn content on the vibration fracture behavior of Sn-Zn and Sn-Zn-Bi solders

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 929-936

  Song, Jenn Ming ^a   Lui, Truan Sheng ^b   Chang, Yea Luen ^b   Chen, L I Hui ^b  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Lead free solders; Sn Zn; Sn Zn Bi; Vibration properties

Indexed keywords

FORCE CONTROL; HARDENING; INTERNAL FRICTION; MICROSTRUCTURE; SOLDERING ALLOYS; VIBRATION CONTROL;

INTERGRANULAR FRACTURING; LEAD-FREE SOLDERS; SN-ZN; SN-ZN-BI; VIBRATION PROPERTIES;

TIN ALLOYS;

EID: 33745051154     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692549     Document Type: Conference Paper

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