Vibration fracture behavior of Sn-Bi solder alloys with various Bi contents

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 666-672

  Song, Jenn Ming ^a   Chang, Yea Luen ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Crack growth; Damping capacity; Tin bismuth; Vibration

Indexed keywords

BISMUTH; CRACK PROPAGATION; DAMPING; EUTECTICS; FRACTURE; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); SOLDERING ALLOYS; VIBRATION MEASUREMENT;

CELL BOUNDARIES; DAMPING CAPACITY; HYPOEUTECTIC; PHASE BOUNDARIES; TIN-BISMUTH;

TIN;

EID: 2442558140     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.666     Document Type: Article

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