SCOPUS 정보 검색 플랫폼

Volumn 26, Issue 1, 2007, Pages 13-18

Microstructure studies of the grinding damage in monocrystalline silicon wafers

Author keywords

grinding; microstructure; silicon wafers; subsurface damage

Indexed keywords

HIGH DENSITY DISLOCATIONS; SUBSURFACE DAMAGE;

DISLOCATIONS (CRYSTALS); FRACTURE; GRINDING (COMMINUTION); MICROSTRUCTURE;

SILICON WAFERS;

EID: 34447123114 PISSN: 10010521 EISSN: None Source Type: Journal
DOI: 10.1016/S1001-0521(07)60020-5 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.