Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed loop AuSn solder-line

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 614-617

  Kim, Seong A ^a   Seo, Young Ho ^a   Cho, Young Ho ^a   Kim, Geun Ho ^b   Bu, Jong Uk ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b LG Electronics Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; GOLD COMPOUNDS; PRESSURE; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

HERMETIC MEMS PACKAGING; HERMETICITY; PRESSURE TEST; PRESSURIZED HELIUM LEAK TEST; SUBSTRATE HEATED SPECIMEN;

MICROELECTROMECHANICAL DEVICES;

EID: 0037817703     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Y.T. Cheng, L. Lin and K. Najafi., "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging," Journal of Microelectromechanical Systems, 2000, pp.3-8.
2. D.G. Mario, Flat and Corrugated Diaphragm Design Handbook, Marcel Dekker, Inc., 1982, Chapter 20.
3. T. Yi, L. Li, and C.-J. Kim, "Microscale Material Testing of Single Crystalline Silicon: Process Effects on Surface Morphology and Tensile Strength", Sensors and Actuators, Vo. A83 (2000), pp.172-178.
4. Department of Defense, Test Method Standard Microcircuits, MIL-STD-883E, Method 1014.9 SEAL part.
5. S. Mack, H. Baumann, and U. Gosele, "Gas Tightness of Cavities Sealed by Silicon Wafer Bonding," Proc. of MEMS'97, pp.488-493.
6. R.C. McMaster, Nondestructive Testing Handbook, American Society for Nondestructive Testing, Inc., 1982, Chapter 3-5.